Manufacturing Technology
Through Hole Assembly
SMT lines ( 0201chip-BGA)
uBGA, CSP, BGA
X-ray inspection for BGA Double sided SMT and mixed technology PCB Repairs ECO rework capabilities
Lead Free Assembly
Test Development
Design for Testability
In-Circuit Testing
Burn-in
ESD Testing
ATE Design
Functional Testing
Power Supplies Testing
Design Support
Electro-Mechanical Design
PCB Layout
Power Supply Design
New Product Introduction
Fast Engineering and Pilot Runs
Supply Chain Management
Engineering Support
Cost Reduction Study
Supply Chain Management
MRP
World Wide Material Procurement
USA and International Manufacturing
Quality System & Reliability
ISO 9001-2000
IPC Workmanship Standards
Mil-Standards
RoHS Compliance
SPC Controls |